Integrated process condition sensing wafer and data analysis system

ABSTRACT

A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This is a continuation-in-part of patent application Ser. No. 10/718,269, filed Nov. 19, 2003, which claims the benefit of U.S. Provisional Patent Application No. 60/430,858 filed on Dec. 3, 2002, U.S. Provisional Patent Application No. 60/496,294 filed on Aug. 19, 2003, and U.S. Provisional Patent Application No. 60/512,243 filed on Oct. 17, 2003. The benefits of the filing dates of provisional applications Nos. 60/496,294 and 60/512,243 are also being directly claimed herein. Each of these applications is also incorporated herein in its entirety for all purposes by this reference.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to semiconductor wafer processing, LCD display glass substrate processing, magnetic memory disc processing, and other devices fabricated from thin film processes, and, more specifically, to a system that can sense and record processing conditions and transmit data to a receiver.

[0004] 2. Discussion of the Related Art

[0005] The fabrication of an integrated circuit, display or disc memory generally employs numerous processing steps. Each process step must be carefully monitored in order to provide an operational device. Throughout the imaging process, deposition and growth process, etching and masking process, etc., it is critical, for example, that temperature, gas flow, vacuum, pressure, chemical, gas or plasma composition and exposure distance be carefully controlled during each step. Careful attention to the various processing conditions involved in each step is a requirement of optimal semiconductor or thin film processes. Any deviation from optimal processing conditions may cause the ensuing integrated circuit or device to perform at a substandard level or, worse yet, fail completely.

[0006] Within a processing chamber, processing conditions vary. The variations in processing conditions such as temperature, gas flow rate and/or gas composition greatly affect the formation and, thus, the performance of the integrated circuit. Using a substrate to measure the processing conditions that is of the same or similar material as the integrated circuit or other device provides the most accurate measure of the conditions because the material properties of the substrate is the same as the actual circuits that will be processed. Gradients and variations exist throughout the chamber for virtually all process conditions. These gradients, therefore, also exist across the surface of a substrate, as well as below and above it. In order to precisely control processing conditions at the wafer, it is critical that measurements be taken upon the wafer and the readings be available in real time to an automated control system or operator so that the optimization of the chamber processing conditions can be readily achieved. Processing conditions include any parameter used to control semiconductor or other device fabrication or any condition a manufacturer would desire to monitor.

[0007] Within the processing chamber a robot transports the test wafer or substrate. One example of a device incorporating a robot is manufactured by the TEL Corporation. For more information about the robot and processing chamber, please refer to U.S. Pat. No. 5,564,889 to Araki, entitled “Semiconductor Treatment System and Method for Exchanging and Treating Substrate,” which is hereby incorporated by this reference in its entirety.

SUMMARY OF THE INVENTION

[0008] A process condition measuring device (PCMD) is disclosed that may be delivered to a target environment, acquire a wide range of data and return to a handling system with little disruption to the target environment or the tool containing the target environment. The PCMD is designed to have similar characteristics to the substrates normally handled by the tool. The characteristics of such substrates are generally specified by industry standards. Thus, for a system designed for 300 mm silicon wafers, the PCMD has a silicon substrate and has similar physical dimensions to those of a 300 mm wafer. Components may be located within cavities in the substrate to keep the profile of the PCMD the same as, or close to that of a 300 mm wafer. Because of its dimensions and its wireless design, the PCMD may be handled by a robot as if it were a 300 mm wafer. It may undergo the process steps undergone by wafers such as etch, clean, photolithography etc. The PCMD records process conditions such as temperature, pressure and gas flow rate during processing and uploads the data when requested. Conditions during transport and storage may also be monitored and recorded.

[0009] Making a PCMD employs multiple process steps similar to those used in semiconductor IC manufacturing. An insulating layer is deposited over the substrate. A conductive layer is deposited and patterned to form traces. Cavities are formed in the substrate surface and components are placed in those cavities. Components are then bonded to traces to form electrical connections. A passivation layer may then be deposited over the surface to protect the substrate, components and the wire bonds.

[0010] PCMDs may be made compatible with harsh environments by protecting components from chemical or electrical damage. Critical components may have covers similar to parts used in packaging ICs. Covers may also be made of specialized materials such as sapphire or, for electrical protection, silicon or metal. PCMDs may also be adapted to high temperatures by incorporating a temperature compensating circuit to allow an oscillator to perform outside its specified temperature range.

[0011] A handling system provides a docking station or base for a PCMD. The PCMD exchanges data with an electronics module when it is docked in the handling system and also receives power from the electronics module. The handling system may comprise an electronics module within a standard substrate carrier such as a front opening unified pod (FOUP). This allows the handling system to be highly integrated with a tool or with facility automation. The PCMD may be moved to and from the FOUP by the tool and the FOUP may be moved from one tool to another by the facility automation. The FOUP provides a clean environment for the PCMD where it may be stored or transported. In addition, loading stations for FOUPs are normally provided with RFID readers to determine the identity of the FOUP and relay the information to a tracking system via a network. By connecting the electronics module in the FOUP to an RFID transceiver, data from the electronics module may be sent to the network where it may be accessed.

[0012] Data acquired from the sensors may be compressed by the electronic system on the PCMD prior to non-volatile storage and/or transmission of the data. The data are represented by temporal and/or spatial differences, thereby significantly reducing the amount of data necessary to represent the sensor measurements. Storage of certain of the acquired data may also be omitted if the condition being monitored by the sensors meets certain criteria. A reduction in the amount of data reduces the size required for a non-volatile memory on the PCMD, conserves its battery power and extends the period of time (runtime) that the PCMD may operate to acquire data between battery charges.

[0013] A handling system may have an alignment module that may move a PCMD within a handling system in order to facilitate communication between the PCMD and the electronics module of the handling system, as well as charging the PCMD battery. Vertical and rotational motion of a PCMD may be achieved by a rotation stage or wheels supporting its perimeter. Raising a PCMD may allow better coupling to the electronics module. Lateral movement of the PCMD may be achieved by a moving belt or wheel that is brought into contact with the lower surface of the PCMD to move the PCMD into position. As an alternative to raising the wafer, a flexible sheet containing a battery charging and/or communication coil may be attached to the underside of the electronics module in a manner so that it may be lowered onto the exposed surface of the PCMD.

[0014] A PCMD may have a pattern on its surface that allows its orientation to be determined. Greycode printed on the edge of a surface of a PCMD may allow the rotational orientation of the PCMD to be determined. Greycode readers may be installed in a handling system so that the orientation of the PCMD is known before it is sent on a survey and after it returns. Such a system does not require movement of the PCMD relative to the readers in order to determine orientation.

[0015] A PCMD may have temperature compensation circuitry to allow components to operate at high temperatures. An oscillator within a clock circuit may have its bias adjusted as the temperature changes so that the oscillator continues to function beyond its specified temperature range.

[0016] Each of the PCMD and the electronics module within the handling system may include a microcontroller based computing system that controls the acquisition, processing, storage, and transmission of data from the sensors on the PCMD, control of the limited amounts of battery power available for use by each, the replenishment of that battery power, and other similar types of processing and control functions.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017]FIG. 1A is a plan view of Process Condition Measuring Device (“PCMD”) 100.

[0018]FIG. 1B is a depiction of components within PCMD 100.

[0019]FIG. 1C is a cross section of a single component within PCMD 100.

[0020]FIG. 1D is a plan view of an embodiment of PCMD 100 with graycode coding.

[0021]FIG. 1E shows PCMD 100 spinning about a central axis 199.

[0022]FIG. 2A is a perspective view of the back of Handling System (“HS”) 200.

[0023]FIG. 2B is a perspective view of the front of HS 200.

[0024]FIG. 2C is a processing tool 260 having a robot that transfers substrates between a substrate carrier and a processing chamber.

[0025]FIG. 2D is a cross-sectional view of processing tool 260.

[0026]FIG. 3A is a cross section of an embodiment of PCMD 100.

[0027]FIG. 3B is a cross section of another embodiment of PCMD 100.

[0028]FIG. 4A is a flowchart depicting the steps of making the cross section shown in FIG. 3A.

[0029]FIG. 4B is a flowchart depicting the steps of making the cross section shown in FIG. 4A.

[0030]FIG. 5A is a cross-section of an E-coil 510 inductively charging a coil 508.

[0031]FIG. 5B is a cross-section of an E-coil 510 inductively charging a coil 508 with a magnetic conductive layer 555.

[0032]FIG. 6 is a circuit diagram of a high temperature crystal oscillator circuit 660.

[0033]FIG. 7 shows a PCMD 700 having four transmitters 728-731.

[0034]FIG. 8A shows a handling system 880

[0035]FIG. 8B shows a portion of a PCMD having greycode 850.

[0036]FIG. 8C shows an alignment module 881.

[0037]FIG. 8D shows handling system 880 with PCMD 800 in the normal position.

[0038]FIG. 8E shows handling system 880 with PCMD 800 in the raised position.

[0039]FIG. 8F shows alignment module 881 with PCMD 800.

[0040]FIG. 8G shows alignment module 881 moving PCMD 800 laterally.

[0041]FIG. 8H shows alignment module 881 raising and rotating PCMD 800.

[0042]FIG. 8I shows E-coil 810 moving vertically towards PCMD 800.

[0043]FIG. 9A shows various communication systems between PCMD 900, handling system 980 and software application 987 that are operated in a manual mode.

[0044]FIG. 9B shows various communication systems between PCMD 900, handling system 980 and a controlling computer 983 that operate in an automatic mode.

[0045]FIGS. 10A-10D show different examples of lids protecting components of PCMDs.

[0046]FIG. 11A is a plan view of another embodiment of a PCMD and FIG. 11B a cross-section thereof taken at section B-B of FIG. 11A.

[0047]FIG. 12 is a block diagram of a microcontroller included in the PCMD and its use.

[0048]FIG. 13 is a flowchart showing acquisition of data and its compression by the microcontroller.

[0049]FIG. 14 is an example table of data obtained by the process illustrated in FIG. 12.

[0050]FIG. 15 shows an example application of the PCMD when measuring temperature.

[0051]FIG. 16A shows a wafer handling system that is a modified version of that shown in FIGS. 8A and 8D through 8I.

[0052]FIG. 16B shows a portion of the wafer handling system of FIG. 16A from an internal view that is orthogonal thereto.

[0053]FIG. 16C is an enlarged view of a portion of FIG. 16B, illustrating the charging of the PCMD batteries.

[0054]FIG. 16D is a top view of the PCMD within the handling system of FIG. 16A.

[0055]FIG. 17 is a schematic block diagram of an electronic system within the wafer handling system shown in FIGS. 16A-16D.

[0056]FIG. 18 is a schematic block diagram of an electronic system on a PCMD.

DESCRIPTION OF EMBODIMENTS

[0057] The measurement system in one embodiment measures processing conditions in various locations of a wafer or substrate and records them in memory for later transmission or downloading of the process conditions. In another embodiment of the measurement system where a processing chamber has windows capable of data transmission, the system is additionally capable of transmitting the processing conditions in real time to a data processing device.

[0058]FIG. 1A illustrates process condition measuring device (“PCMD”) 100, an embodiment of the present invention. PCMD 100 is part of a process measurement system, the other components of which will be described later with reference to FIG. 2. PCMD 100 comprises a substrate such as a silicon wafer, glass substrate, or other substrates well known in the art. Substrate 102 (not visible in plan view) is preferably a silicon wafer and may be of any diameter but is preferably an 8 or 12 inch diameter wafer. The diameter is preferably that of wafers or other substrates being processed in the processing chamber for which the PCMD is to be used. If integrated circuits are being fabricated on silicon wafers in the processing chamber, the substrate of the PCMD is preferably also silicon but need not necessarily be doped.

[0059] A number of components are integrated to form PCMD 100. Sensors 124 are distributed about PCMD 100 and are, therefore, capable of detecting gradients in various processing conditions across the surface of the substrate. Sensors 124 are connected to the microprocessor 104 through conductive traces 120. Conductive traces 120 preferably comprise aluminum, but may comprise any conductive material. The formation of PCMD 100, including the conductive traces and the other components will be described later with reference to FIGS. 3 and 4. Microprocessor 104 preferably includes flash memory cells for storing the processing conditions and other instructions necessary for the operation of PCMD 100. However, the flash, or other type memory, may alternatively be part of a discrete EPROM or EEPROM rather than being an integral part of microprocessor 104. Clock crystal 132 generates a timing signal used in various operations of PCMD 100. Transmitter 128 preferably comprises a light emitting diode (LED) for transmitting data. Around transmitter 128 is a radio frequency (RF) inductive coil 108 that receives data and serves to inductively charge power sources 112A and 112B. In one embodiment of the invention, transmitter 128 may also act as a transceiver and receive data as well as transmit data. Additionally, coil 108 may also act not only as a receiver, but also as a transmitter. Thus, coil 108 may serve as a receiving unit that may receive both data and power.

[0060] In the embodiment illustrated, power sources 112A and 112B are thin film lithium ion batteries that are equidistant from the center of the PCMD 100. The thin 0.25 mm thick power sources allow for a thin overall PCMD structure with a thickness of 0.70 mm, which is comparable to a production wafer and compatible with the robot arms typically used in wafer handling procedures. These power sources have previously been common to under-skin medical implants where they are similarly inductively charged. Power sources 112A and 112B are capable of continuous operation at temperatures up to roughly the melting point of lithium, around 180 degrees Centigrade. The equidistant spacing of the power sources 112A, 112B shown in FIGS. 1D and 1E, maintains the balance of PCMD 100 which is beneficial in situations where PCMD 100 may be spinning within a processing module. FIG. 1E shows the central axis 199 of PCMD 100 passing through the center of PCMD 100. Central axis 199 is perpendicular to a surface 198 of PCMD 100. The center of gravity of PCMD 100 lies along central axis 199. Central axis 199 is the axis of rotation when PCMD is spun in a processing module. Batteries 112A and 112B are equidistant from central axis 199 and are 180 degrees apart. Thus, where batteries 112A and 112B are of the same mass, their combined center of gravity is along central axis 199. Additionally, the other components are arranged in order to maintain as uniform a mass and thermal profile as possible. A passivation layer 116 and an optional shield layer are formed above all of the components of PCMD 100 in order to protect the components and substrate from various processing conditions. The layers that make up PCMD 100 will be described in further detail later with reference to FIGS. 3 and 4.

[0061] Coil 108 of FIG. 1 may be located within a cavity in the substrate. Coil 108 may be extremely thin so that it does not add to the overall height of the PCMD 100 when placed on the surface or in shallow cavity. For example, FIG. 5A shows a cross-section of a coil 508 in a cavity and its inductive coupling with an external coil 510 for inductive charging of the batteries on the substrate and/or transmitting data between the two. In this example, coil 508 includes several windings of increasing radius. However, coil 508 is only one winding in height so that the thickness of coil 508 is approximately the same as the thickness of the conductor used for the winding. Coil 508 may be located in the middle of the wafer as shown in FIG. 1A. FIG. 5A shows a similar coil 508 in a cavity 550 within the substrate 502. FIG. 5A shows the position of coil 508 with respect to an E-coil 510 located in electronics module 508. E-coil 510 may be used to supply power to the PCMD 100 by inducing an electrical current in the windings of coil 508. E-coil 510 may also be used to transmit data to coil 508. Thus, the induced field is used to transmit both power and data to PCMD 100. E-coil 510 typically provides an RF field at a frequency of 13.56 MHz. One advantage of placing coil 508 so that its axis passes through the center of the PCMD is that it may easily be aligned with an external unit such as E-coil 510 because the rotational orientation of PCMD 100 does not affect the position of the coil 508. Thus, E-coil 510 may serve as a transmitting unit that may transmit both power and data.

[0062]FIG. 5B shows coil 508 having a magnetic conductive layer 555. Magnetic conductive layer 555 may be made of a ferrite material. The induced field is concentrated in magnetic conductive layer 555 and so the magnetic field in the substrate 502 is minimized. Where the substrate 502 is made of a conductive material such as doped silicon this is especially advantageous. When the RF field extends into a conductive substrate the changing magnetic field in the substrate induces eddy currents. These eddy currents dissipate the RF field and result in a lower efficiency of power transfer between E-coil 510 and coil 508. In addition, eddy currents flowing through a conductive substrate may heat the substrate and could damage PCMD 100.

[0063] Clock crystal 132 (FIG. 1B) is part of a crystal oscillator circuit. FIG. 6 shows an example of a high temperature crystal oscillator circuit 660 that may be used for this application. High temperature crystal oscillator circuit 660 is comprised of a conventional crystal oscillator circuit 661 and a biasing circuit 670. The conventional oscillator circuit 661 includes a crystal 632, amplifier 662 and capacitors 663 and 664. The amplifier 662 and capacitors 663 and 664 are within CPU 604, while the crystal 632 is external to the CPU. The biasing circuit 670 includes counter 671, ring oscillator 672 and bias control unit 673 within CPU 604. In addition, biasing circuit 670 includes a series of resistors 675 that are connectable to the crystal under the control of bias control unit 673. Resistors 675 are external to CPU 604.

[0064] Amplifier 662 provides positive feedback to maintain the oscillator signal. Amplifiers available in commercially produced ICs, such as amplifier 662, are specified as working over a certain range of temperature, for example 0-85 degrees centigrade. When the temperature is higher than the specified range, conventional oscillator circuit 661 may no longer function correctly. Threshold voltages of components in the amplifier may shift which eventually causes oscillation to cease or startup to fail. When amplifier 662 is working within its specified temperature range it produces a signal with a 50% duty cycle. With increasing temperature the duty cycle increases and as the duty cycle approaches 100% conventional oscillator circuit 661 ceases to function.

[0065] Biasing circuit 670 overcomes this problem by biasing the input of amplifier 662 in order to maintain a 50% duty cycle. Counter 671 uses the input from ring oscillator 672 to determine the duty cycle. Counter 671 counts the number of clock cycles of ring oscillator 672 during the “on” phase of the output of amplifier 662. It then counts the number of clock cycles of ring oscillator 672 during the “off” phase of the output of amplifier 662. The counts are sent to the bias control unit 673 where the duty cycle is determined. If these counts are equal then the duty cycle is 50%. If the count for the “on” phase exceeds the count for the “off” phase, then the duty cycle is greater than 50%. The frequency of ring oscillator 672 is greater than the frequency of the output of conventional oscillator circuit 661. Typically, the conventional oscillator circuit has an output frequency of about 32 kHz while the ring oscillator has an output frequency of about 400 kHz-4 MHz. Ring oscillator 672 may suffer from a change in frequency at high temperature. However, because the output for two periods are compared, the absolute value of the output over a given period does not affect the determination of duty cycle.

[0066] If the duty cycle is determined to be greater than 50% the bias control unit 673 may modify the bias input 676 to reduce the duty cycle. This may be done in a number of ways. In the example shown in FIG. 6, a series of resistors 675 of different resistances are connected between a bias voltage and bias input 676. The bias voltage used may be Vcc on the CPU chip. In this way, the voltage and current at the input of amplifier 662 may be controlled to bring the duty cycle back to 50%. Using this technique, the effective range of high temperature crystal oscillator circuit 660 may be extended from the stated upper limit of the CPU chip 604 (85 degrees centigrade) to as high as 150 degrees centigrade. This allows PCMD 100 to use standard parts in conditions that would otherwise require custom parts. As alternatives to using resistors 675, other comparable means may be used to modify impedance such that a change in bias is achieved. These alternatives include an electronic potentiometer, transistor, voltage resistor network.

[0067] Transmitter 128 shown in FIG. 1A may be used to transmit data from the PCMD. Here, transmitter 128 is an LED. This is a more energy efficient way to transmit data than using RF via coil 108. For transmission from the PCMD energy efficiency is important, whereas for transmitting data to the PCMD energy is generally not as critical so that RF may be used. In the example shown in FIG. 1A the transmitter is located at the center of the upper surface of the PCMD. Placing LED 128 in the center allows it to be more easily aligned with any external receiver because the position of LED 128 with respect to the external receiver will not vary if PCMD 100 is rotated. This may be important where PCMD 100 is rotated during a survey as occurs in some environments.

[0068] In another embodiment shown in FIG. 7, four transmitters 728-731 are located around coil 708. This example also uses LEDs as transmitters 728-731. Using multiple LEDs allows a receiving unit 777 in an electronics module 778 to receive a good signal even where receiving unit 777 is not aligned with the center of PCMD 700. Where one LED at the center of a PCMD is used (as in FIG. 1) but the receiving unit in the electronics module is offset from the center, a poor signal or no signal may be received because the LED directs light in a limited cone. The receiving unit 777 may be offset because the E-coil occupies a space covering the center of the PCMD. Thus, it is desirable to have one of LEDs 728-731 aligned with the offset position of the receiving unit 777. This requires more than one LED (four, in this example) so that one LED is below the receiving unit regardless of the rotational orientation of the PCMD 700. However, for energy efficiency it is desirable to transmit via only one LED. Therefore, a technique is provided for determining the optimum LED to transmit data.

[0069] The optimum LED is determined as part of a hand-shaking routine between the electronics module 778 and the PCMD 700. First, the electronics module 778 sends a signal to the PCMD 700 via the RF coil 708, telling PCMD 700 to begin transmission. The PCMD 700 begins transmitting using LED 728. If the electronics module 778 does not receive a signal after a predetermined time, another signal is sent to the PCMD 700 requesting a transmission. The PCMD 700 transmits using LED 729. If receiving unit 777 receives no signal, then LED 730 is used. If no signal is received from LED 730, then LED 731 is used. Because LED 731 is directly below receiving unit 777, the signal is received and LED 731 is identified as the optimum LED The PCMD then uses only the optimum LED 731 and may turn off the other LEDs 728-730 to conserve energy. This process of selecting one of the LEDs to engage in the communication is carried out on the PCMD 700 by the processing unit 104. A processor within the electronics module 778 controls its operation, which is more limited. More LEDs may be used depending on the configuration of the receiving unit or units. LEDs may be arrayed in different locations and pointed in different directions depending on where the data is to be sent.

[0070] Utilizing the limited storage capacity of the power sources efficiently is desirable to maximize the amount of data and measurement time of the PCMD. The sensor groups that are activated are user selectable, the groups are only activated when necessary. Outputs from selected groups are multiplexed and only written into memory at selected intervals. The output is also compressed to minimize the amount of time and energy needed to store the data.

[0071] As defined herein, “processing conditions” refer to various processing parameters used in manufacturing an integrated circuit. Processing conditions include any parameter used to control semiconductor manufacture or any condition a manufacturer would desire to monitor such as, but not limited to, temperature, etch rate, thickness of a layer on a substrate, processing chamber pressure, gas flow rate within the chamber, gaseous chemical composition within the chamber, position within a chamber, ion current density, ion current energy, light energy density, and vibration and acceleration of a wafer or other substrate within a chamber or during movement to or from a chamber. Different processes will inevitably be developed over the years, and the processing conditions will, therefore, vary over time. Therefore, whatever the conditions may be, it is foreseen that the embodiments described will be able to measure such conditions. In addition to measuring these conditions during the processing of semiconductor wafers, the systems and techniques described herein may also be applied to the monitoring similar conditions during processing of other types of substrates.

[0072] Sensors 124 are used for detecting various processing conditions are mounted on or fabricated in substrate 102 according to a well-known semiconductor transducer design. For measuring temperature, a popular transducer is an RTD or thermistor, which includes a thin-film resistor material having a temperature coefficient. A magneto-resistive material may also be used to measure the temperature through the amount of magnetic flux exerted upon substrate 102. A resistance-to-voltage converter is often formed within the substrate between distal ends of the resistive-sensitive material (either thermistor or magneto-resistive material) so that the voltage may easily be correlated with a temperature scale. Another exemplary temperature sensor includes a thermocouple made of two dissimilar conductors lithographically formed in the layers of the substrate. When the junction between the conductors is heated, a small thermoelectric voltage is produced which increases approximately linearly with junction temperature. Another example of a temperature sensor includes a diode that produces a voltage that increases with temperature. By connecting the diode between a positive supply and a load resistor, current-to-voltage conversion can be obtained from the load resistor. Another sensor is a piezoelectric device such as a quartz tuning fork fabricated from quartz crystal cut on a crystal orientation which exhibits a temperature dependent frequency of oscillation. The sensor's oscillating frequency can be referenced against a master oscillator formed by a piezoelectric device such as a quartz tuning fork, which is fabricated from a crystal oriented to minimize frequency change with temperature. The frequency difference between the sensor and master oscillator would provide a direct digital temperature dependent signal. Piezoelectric sensors may also be used to sense mass change to measure deposition mass and rates or other process conditions.

[0073] Sensors 124 may also be used to measure pressure, force or strain at select regions across substrate 102, either as a discrete sensor or a sensor integrally formed in the layers of substrate 102. There are many types of pressure transducers capable of measuring the atmospheric pressure exerted upon the wafer. A suitable pressure transducer includes a diaphragm-type transducer, wherein a diaphragm or elastic element senses pressure and produces a corresponding strain or deflection which can then be read by a bridge circuit connected to the diaphragm or cavity behind the diaphragm. Another suitable pressure transducer may include a piezoresistive material placed within the semiconductor substrate of substrate 102. The piezoresistive material is formed by diffusing doping compounds into the substrate. The resulting piezoresistive material produces output current proportional to the amount of pressure or strain exerted thereupon.

[0074] Sensors 124 may also be used to measure flow rate across substrate 102. In addition, humidity and moisture sensors can also be formed upon substrate 102. A well-known method for measuring flow rate, a hot-wire anemometer, may be incorporated into substrate 102. Fluid velocity is based upon the frequency of vortex production as a streamlined fluidic flow strikes a non-streamlined obstacle positioned on or in substrate 102. Measurement of fluid flow generally involves the formation of special vortices on either side of the obstacle. Thus, an alternating pressure difference occurs between the two sides. Above a threshold (below which no vortex production occurs), the frequency is proportional to fluid velocity. Of many methods of detecting the alternating pressure difference, a hot thermistor is preferably placed in a small channel between the two sides of the obstacle. The alternating directions of flow through the capitalized channel periodically cool the self-heated thermistor thereby producing an AC signal and corresponding electric pulses at twice the vortex frequency. Therefore, an obstacle protruding from substrate 102 in front of a thermistor can provide solid-state flow rate measurement. Heat can be transferred between self-heated thermistors placed in close proximity to each other. Fluid flow transfers thermal energy between the adjacent thermistors causing a thermal imbalance proportional to mass flow. Two or more adjacent sensors can be arrayed to measure flow along a vector, or multiple flow vectors may also be sensed. The thermal imbalance can be detected to produce a DC signal related to mass flow. Flows in multiple directions can be compared to detect flow vectors.

[0075] Sensors 124 can also be used to measure the gaseous chemical concentration placed upon substrate 102. Chemical composition sensors utilize a membrane which is permeable to specific ions to be measured. Ideally, the membrane should be completely impermeable to all other ions. The conductivity of the membrane is directly proportional to the transport of select ions which have permeated the membrane. Given the variability of membrane conductivity, measurements can be taken which directly correlate to the amount of chemical ions present within the ambient surrounding substrate 102.

[0076] Sensors 124 may also be used to measure ion current density and ion current energy with a parallel plate structure, an array of collecting plates, and collecting plates with control grids supported above the collecting plates. The current flowing between parallel plates, or to the array of collecting plates will increase with ion current density. Ion current energy can be detected by applying a constant or varying DC potential on the grids above the plates. This will modulate current flow with ion current energy allowing the energy distribution to be detected. This is useful in monitoring and regulating a deposition or etching process.

[0077] A piezoelectric transducer/sensor may also be integrated into substrate 102 to measure the resonant frequency of a layer and thus the mass or thickness of the layer.

[0078] Additionally, sensors 124 can also be used to detect a change in position or displacement of an object spaced from substrate 102. Exemplary displacement transducers include electro-optical devices which can measure photon energy (or intensity) and convert photon energy to an electric field or voltage. Relatively well known electro-optical devices include light-emitting diodes, photodiodes, phototransistors, etc., which can be formed upon a semiconductor substrate or discrete devices embedded within the substrate or placed on the surface. Displacement sensors are used to provide accurate information about electrode spacing within an etch or deposition chamber, and can also provide spacing information between a wafer and corresponding masks and/or radiation source.

[0079]FIG. 1B illustrates some components of PCMD 100 within substrate 102. FIG. 1B is not a true cross section of PCMD 100, but only serves to illustrates how the components such as sensors 124, oscillator 132, microprocessor 104, power source 112, resistor 113, and capacitor 115 are located within recesses formed in PCMD 100. Further details of this are shown in FIG. 1C, where a component 140 is affixed to a cavity 142 within substrate 102 (and the other layers on substrate 102) with bonding material 144. Bond wires 148 electrically couple the component 140 with conductive traces 120 seen in FIG. 1A. Bond wires 148 and component 140 are covered with potting material 152.

[0080] In the case where the PCMD 100 measures a parameter through a number of sensors distributed across the wafer substrate 102 that are temperature sensitive, it is desirable that the sensors, processing unit 104 and other components be mounted on the substrate in a manner that does not significantly change or perturb the temperature across the wafer. This is particularly important when the measured parameter is temperature. A temperature PCMD 100 is generally used to measure the temperatures that exist across a wafer or other substrate during an actual processing operation, such as when being heated by a hot plate or when positioned within a processing chamber. The PCMD 100 is thus desirably made to have thermal properties as close to those of the actual wafer being processed as is reasonably possible. This improves the accuracy of the temperature profile readings across the test wafer 102 and eliminates or minimizes the amount of processing that needs to be done to compensate or correct the temperature readings for perturbing effects of the circuit elements added to the wafer.

[0081] The individual components are therefore preferably carried by the wafer 102 (FIGS. 1B and 1C) in a manner that does not alter the thermal characteristics across the wafer. The components, where possible and particularly in the case of the temperature sensors 124 and other elements, are bare integrated circuit die (chips) without the usual commercial package surrounding them. Thermal compatibility is thus maintained with a silicon wafer 102 since the dies are primarily also silicon material. An individual die is then connected by wire bonds directly from bonding pads on the die to the conductive traces adjacent the die. The conductive traces extend across the surface of the wafer with a layer of dielectric therebetween.

[0082] Although the circuit chips and other components could be mounted on the top surface of the test wafer, it is preferable to have them contained in cavities 142 formed in the surface of the wafer. Since the die are primarily of the same material as the silicon wafer substrate, any remaining space in the cavities around the die is filled with material 152 that has substantially the same thermal characteristics as the silicon substrate and die. This restores, in the area of each cavity, the thermal characteristics of the wafer 102 to that of the area before the cavity was formed. Perturbations of the temperatures being measured across the wafer 102 that might be caused by those of the added components that can be mounted in this manner are thus eliminated or at least reduced to a level that provides accurate results without having to process the data obtained from the sensors to compensate for such perturbations.

[0083] The depth of the each cavity 142 is preferably about that of the die placed within it, plus the thickness of the bonding material 144. The bonding material 144 that attaches the die 140 within the cavity preferably thermally integrates the die 140 to and with the wafer 102. That is, the characteristics of thermal conductivity (or the inverse, thermal resistance RTH) and thermal capacitance (CTH) of the layer 144 are made to be as close to that of the wafer 102 as possible. For mechanical stability, an equivalence of their coefficient of thermal expansion (TC) is also desired. Although the layer 144 could also be made electrically conductive, thereby placing the substrate of the integrated circuit die 140 at the same potential as the wafer 102, it is preferably to electrically insulate the die from the substrate 102. The potential of the individual die can then be controlled by connecting it to one of the conductive traces across the surface of the wafer 102.

[0084] The bonding material layer 144 is preferably an epoxy material filled with small particles of diamond (such as in a range of 2-9 microns in diameter) because of diamond's extremely high thermal conductivity. Diamond is sufficiently electrically non-conductive to be positioned between two semiconductors. The viscosity of the starting epoxy material and the concentration of the diamond particles are preferably chosen so that the viscosity of the combination remains low enough to flow into a very thin layer 144 of uniform thickness. The layer 144 therefore introduces little or no thermal resistance or capacitance between the die 140 and the wafer substrate 102.

[0085] The potting material 152 is also preferably made to have thermal characteristics as close to that of the wafer as possible. An example is to use a polymer such as a polyimide that is filled with small particles having thermal characteristics that match those of the wafer 102, one suitable material being aluminum nitride. If the die 140 is being electrically isolated from the wafer 102, these particles are coated with an electrical insulation material, silicon dioxide being an example. Since the polymer material will usually have thermal characteristics that do not match those of the wafer 102, it is filled over fifty per-cent by volume with such particles, and preferably over seventy or eighty per-cent. This composite material is placed around and over the circuit die in a liquid form and allowed to cure into a solid, as shown in FIG. 1C.

[0086] It is of course very beneficial to thermally integrate the temperature sensors with the wafer substrate of a temperature measuring device in order to obtain readings of the temperature of the wafer. The sensor may be of a type formed on an integrated circuit chip and therefore mounted to the wafer substrate in the manner described above. In response to being provided power, such a circuit chip outputs an electrical parameter that is proportional to its temperature. An example is an integrated circuit temperature sensor available from National Semiconductor Corporation, identified as LM20, which may be obtained as a bare chip without the normal packaging. This chip outputs an analog voltage of a level dependent upon its temperature, and which therefore can be electronically converted to a temperature measurement.

[0087] The mounting of other integrated circuit chips and components to the wafer 102 in the manner described above has the beneficial effect of reducing their effect on the measurement of such temperature sensors. This is particularly beneficial when the wafer instrument is measuring temperatures that are rapidly increasing or decreasing. In this case, an attached chip or other component not thermally integrated with the wafer substrate could cause a transient cold or hot spot, respectively, to occur on the wafer that affects the instantaneous measurement of one or more of the sensors.

[0088]FIG. 1D illustrates an embodiment of PCMD 100 with graycode coding 150 around the edge. This graycode coding is used to determine the position or rotation of the PCMD with regard to reference axes, and will be described in more detail later.

[0089]FIGS. 2A and 2B illustrate PCMD handling system (“HS”) 200. Handling system 200 generally speaking includes a user interface and various electronic components, including a microprocessor and memory, for transferring data to and from a number of PCMDs and for configuring, recharging, and transporting the PCMDs.

[0090] Cassette 204 can accommodate several PCMDs and may be located at an opening of a processing chamber or a tool that has multiple process chambers such that a robot arm may automatically place or remove the PCMDs within one of the various slots 250 of cassette 204. Cassette 204 is a standard cassette that is compatible with a range of tools. Alternatively, a modified cassette could be used as long as it is compatible with the mechanical automation used within the facility where a PCMD is used. FIG. 2A illustrates the back or process side of HS 200. The PCMDs are inserted and removed from the process side. One PCMD 100 is shown just below electronics module 208 and above charging board 216. When a PCMD is placed in the cassette, its power source(s) are inductively charged by electronics module 208 and charging board 216. The source of the power is batteries positioned behind battery holder caps 212. An additional charging board may also be present in a push/pull configuration to increase the inductive charging rate. Although the embodiments described thus far utilize inductive charging, other embodiments may utilize optical components for charging and data transmission, although with the use of these optical components alignment is much more critical to proper recharging and data transmission. And a wire connection may alternatively be made when the PCMD 100 is placed into the cassette 204 for battery charging and/or data transmission but this is less convenient and thus not preferred.

[0091] In any embodiment, the PCMDs may include graycode coding around the periphery, and HS 200 may also have optical sensors that detect the alignment of the PCMD while in the cassette 204 with the graycode coding (FIG. 1D). Therefore, the wafer can be optimally aligned for data recharging and data transmission. Additionally, if a PCMD returns with a different alignment than it departed with, this may indicate that it rotated some amount in the processing chamber, and that this rotation should be taken into account when analyzing the processing condition data gathered from the chamber or other environment.

[0092] Substrates are typically stored and transported in a substrate carrier such as cassette 204. Processing tools are adapted to a particular standard substrate carrier. Typical tools have robots that move substrates from a substrate carrier through the tool and back to a substrate carrier. Substrate carriers within a facility are interchangeable so that the robot may be calibrated to a substrate carrier and continue to operate with similar substrate carriers without being recalibrated. A single substrate carrier standard is used so that a substrate carrier may be moved from one tool to another and the robot in each tool may transport substrates to and from the substrate carrier.

[0093]FIG. 2C shows a view of a processing tool 260 that includes a robot 261 that transfers substrates to a processing chamber 269. The robot has a mechanical arm 262 with a blade (or endeffector) 263 attached to the end of arm 262 that can pick up a substrate 264. Substrate 264 is held in a substrate carrier 265 so that the blade 263 may be extended under substrate 264 to pick up substrate 264. Blade 263 may rise to lift substrate 264 or substrate 264 may be lowered onto blade 263. The position of substrate 264 is important to allow blade 263 to pick up substrate 264. Typically a substrate carrier has multiple slots, each slot holding one substrate. A slot is open on one side to allow a substrate to be removed. A slot establishes the position of a substrate. In particular the height of a substrate above the bottom surface of the cassette is established to allow a substrate to be picked up. The bottom surface of the cassette may be placed on a platform and the position of a substrate above the platform is accurately established so that the robot may automatically pick it up.

[0094]FIG. 2D shows a side view of processing tool 260 showing blade 263 extending under substrate 264 while substrate 264 is in substrate carrier 265. The height of substrate 263 above the bottom surface 266 of substrate carrier 265 is established. Each slot establishes the position of a substrate so that blade 263 may be inserted between substrates without touching them. A processing tool robot is generally calibrated to a standard substrate carrier so that substrates may be picked up or dropped off to any slot. Standard substrate carriers are used throughout a particular facility so that various tools are calibrated to a standard substrate carrier. Thus, substrates are repeatedly presented to a robot at the same positions and no recalibration is needed from one substrate carrier to another. Presenting a PCMD to a robot at one of the calibrated positions allows the PCMD to be transferred as if it were a standard substrate. Incorporating an electronics module in a single unit with a substrate carrier that presents a PCMD in this way provides a convenient location to exchange data and to recharge the PCMD in an automated fashion.

[0095] In some embodiments a HS is adapted for use with a substrate carrier other than cassette 204 such as a front opening unified port (FOUP) thus forming a handling system (or dock) where a PCMD may be stored, transported, charged and in which data may be exchanged. FIG. 8A shows an example of such a handling system 880. A FOUP is an industry standard carrier for handling 300 mm wafers. The specifications of both the FOUP and of 300 mm wafers are set by industry standards established by SEMI. A FOUP is particularly suitable for use as part of a HS. It is designed to hold wafers and to be compatible with a wide range of semiconductor processing and metrology equipment. It protects the PCMD and provides a clean environment for it so that the PCMD does not pick up contamination that might be brought into a target environment. When handling system 880 is placed at a loading station for a particular piece of equipment, the PCMD may be robotically transferred from the handling system to a target environment such as a process chamber using the same robot that is used for 300 mm wafers without requiring reconfiguration. Thus, handling of a PCMD may be identical with handling of a 300 mm wafer. Likewise, handling of handling system 880 may be identical to handling of a FOUP. The PCMD measures and records the conditions in the target environment during a specified period, for example, during a particular process recipe. Then, the PCMD is automatically returned to the handling system 880. Transfer of handling system 880 from one piece of equipment to another may also be automated. Thus, the combination of a PCMD and handling system 880 allows a PCMD to be delivered to its destination with a little human intervention, little disturbance to the production environment and minimal contamination to the target environment.

[0096] Inside handling system 880, an electronics module 808 similar to electronics module 208 (FIGS. 2A and 2B) may be mounted. The electronics module 808 contains a battery, an E-coil, and a data-receiving unit. A PCMD 800 may be placed adjacent to the electronics module, in this example the PCMD 800 is below the electronics module 808. In this position, it may receive RF power and RF data signals from the electronics module. It may transmit data by LED to the electronics module 808.

[0097] Handling system 880 may also include optical readers to observe the PCMD 100 and determine its rotational orientation. In the prior art, wafers are rotated in a flat finder or notch finder to align them in a desired rotational orientation. A flat finder usually rotates the wafer about its axis above a set of optical sensors that are directed at the edge of the wafer. These sensors detect the flat (or notch) of the wafer as it passes and thus determine the rotational orientation. Subsequently, wafers may be realigned. Thus, relative motion between the wafer and the sensors is required. By using a greycode on a surface of a PCMD and having stationary optical readers, the rotational position of the wafer may be determined without any relative motion between the wafer and the optical reader.

[0098]FIG. 8B shows a section of an edge of a PCMD 100 having greycode 850. Greycode provides a pattern that uniquely identifies locations at the edge of the wafer. Greycode is generally a code whereby successive words change by just one bit. On the wafer surface this is represented by changes between light and dark areas created by patterning a deposited layer. A word may be read along a radius such as A-A′ or B-B′. The word read at A-A′ would be 1,1,1,0, and at B-B′ would be 1,0,1,1, where light represents 1 and dark represents 0. This example uses a word of four bits. Using a word of 8 or 9 bits allows better resolution because a larger number of uniquely identified locations are possible. For example, with 8 bits, 256 different uniquely identified locations are possible. A reader, such as a linear array is used to determine the unique word at the location of the reader and also the position of the edge of the wafer. With two such readers, the rotational orientation of the wafer and the position of the center of the wafer may be found. The greycode may be located outside the area of the PCMD where the sensors are located so that sensors do not impinge on the greycode area and the greycode does not affect the sensors. Alternatively, where sensors impinge on the greycode area, the readers may be located so that at least one reader will be able to read the greycode. For example, where sensors are spaced 60 degrees apart near the edge of a PCMD, the readers may be spaced 90 degrees apart so that if one reader is aligned with a sensor then the other reader will have a clear reading. Both readers should still read the position of the edge of the PCMD so that the position of the center of the PCMD may be determined.

[0099] While rotation of a PCMD is not required to determine rotational orientation where a greycode is used, movement of a PCMD may be desirable for other reasons. Inductive coupling between PCMD 800 and electronics module 808 improves as the distance between them decreases. Improved alignment between the position of the center of PCMD 800 and electronics module 808 may also improve coupling. If the coupling is improved, energy transfer is more rapid and the time to recharge PCMD 800 may be reduced accordingly. Communication may also be improved when PCMD 800 is correctly placed. Thus, moving PCMD 800 to the optimum position relative to electronics module 808 may be of value. Rotation of PCMD 800 may be desirable so that a particular rotational orientation of PCMD 800 may be selected. Typically, maintaining the same orientation from one survey to another will be desirable. In this way, data from one survey may be accurately compared with data from another survey as individual sensors collect data at the same locations each time. It may be necessary to rotate PCMD 800 for alignment with process chamber elements such as positioning of specific PCMD sensors over heating zones to correlate PCMD temperature profiles with heater zones. Sometimes, it is desirable to change the rotational orientation of a PCMD between surveys. A PCMD may have some inherent nonuniformity due to variation between individual sensors. Performing multiple surveys with different PCMD orientations allows the effects of such nonuniformity to be reduced or eliminated. For example, a PCMD may perform surveys at a first orientation, then at 90 degrees, 180 degrees and 270 degrees offset from the first orientation. The data from these surveys may then be averaged to provide a more accurate result.

[0100]FIG. 8C shows an alignment module 881 that can move a PCMD within a handling system such as handling system 880. Alignment module 881 includes a base structure 884 that forms a rigid platform for mounting other components. Base structure 884 is designed to fit in a slot within a handling system. For example, where handling system 880 is sized for 300 mm silicon wafers, base structure 884 may be a disk with a diameter of approximately 300 mm. However, base structure may be thicker than a silicon wafer because it does not need to be moved in or out of a slot. Base structure 884 may be made of a strong, rigid material such as a metal or plastic.

[0101] A housing 887 is mounted to the upper surface of base structure 884. Extending from the upper surface of housing 887 are a rotation stage 883 and an arm 888. Housing 887 may provide some support for rotation stage 883 and arm 888 and also provides some containment for any particles produced by moving parts enclosed within housing 887.

[0102] Arm 888 is a movable part that can be retracted into housing 887 or extended so that it protrudes from housing 887. Arm 888 may be moved by an electric motor in response to a command signal from an electronics module. At the end of arm 888 is a belt 882. Belt 882 passes around a wheel or bearing so that it may rotate around the end of arm 888. Alternatively, a wheel alone may be used instead of belt 882. In another example, instead of a pivoting arm such as arm 888, a post may be used. Such a post moves vertically with a wheel or belt extending from its upper surface. Alternatively, PCMD 800 may be raised and supported by wheels around its perimeter. The wheels pushing up on the wafer perimeter can raise PCMD 800 so it is floating above the FOUP or cassette ledge. By rotating the wheels, PCMD 800 can be centered by driving it into the V-shaped slot and then retracting it back a specified distance. PCMD 800 can then be rotated to the desired rotational angle.

[0103] Rotation stage 883 is a disk that protrudes above the upper surface of housing 887. Rotation stage 883 may be rotated and may also be extended in the vertical direction. Rotation is possible in both the raised and lowered position but is typically performed in the raised position.

[0104] A robot blade detector 886 is mounted to base structure 884. Robot blade detector 886 may be an optical detector that can detect the presence of an object in its field of view. Robot blade detector 886 is located so that its field of view is placed where a robot blade from a host system may extend.

[0105]FIGS. 8D and 8E show alignment module 881 located within handling system 880. Base structure 884 extends into a slot in handling system 880 to support alignment module 881. Base structure 884 may be fixed in this position to provide a stable platform. Electronics module 808 is located above alignment module 881. PCMD 800 is between alignment module 881 and electronics module 808. FIG. 8D shows PCMD 800 in its normal position. The edges of PCMD 800 are resting on shelves provided within handling system 880. FIG. 8E shows PCMD 800 in a raised position. In this position it is closer to electronics module 808 so that coupling of RF power between electronics module 808 and PCMD 800 is improved. PCMD 800 is raised to this position by rotation stage 883.

[0106]FIGS. 8F-8H show alignment module 881 aligning PCMD 800. Each of FIGS. 8F-8H shows two perspectives. The left view is from above and to one side. The right view is a corresponding cross-sectional view. FIG. 8F shows PCMD 800 positioned above alignment module 881. PCMD 800 is held at its edges as in FIG. 8D. Arm 888 is retracted and is therefore not visible in this view. Rotation stage 883 is clear of PCMD 800. PCMD 800 may not be centered correctly at this point. This means that the center of PCMD 800 may not be directly under the center of an electronics module. Also, PCMD 800 may not have the desired rotational orientation. Either linear or rotational misalignment of PCMD 800 may be detected by greycode readers as described above. In order to obtain an accurate map of conditions measured by PCMD 800 the positions of the sensors on PCMD 800 must be known. Thus, any map generated assumes a certain rotational orientation. It is generally desirable that PCMD 800 be returned to this orientation if any change occurs.

[0107]FIG. 8G shows arm 888 in the raised position. With arm 888 in this position, belt 882 contacts the underside of PCMD 800. Belt 882 engages the underside of PCMD 800 and drags PCMD 800 in the direction indicated. In a handling system this direction corresponds to dragging the PCMD deeper into its slot. Therefore, the travel of PCMD 800 is limited by the physical limits of the slot. Belt 882 may be a belt that is turned by motor and that has a surface that provides sufficient traction to drag PCMD 800.

[0108]FIG. 8H shows alignment module 881 with arm 888 in the retracted position (out of sight) and rotation stage 883 in a raised position. PCMD 800 is supported by rotation stage 883. PCMD 800 is clear of other parts of the handling system at this point. PCMD 800 may be rotated by rotation stage 883 until it reaches a desired orientation. PCMD 800 may remain in a raised position for recharging from electronics module 808. When recharging is complete, rotation stage 883 may be lowered and PCMD 800 may be returned to its normal position where it may be picked up by a robot blade that extends under it and lifts it from its slot

[0109] Robot blade detector 886 ensures that alignment module 881 does not attempt to engage PCMD 800 while the robot blade is extended under PCMD 800. If alignment module 881 tried to engage at such a time, damage could occur to PCMD 800, alignment module 881 or the robot blade. To prevent this alignment module 881 may have an interlocking mechanism to prevent it from operating when robot blade detector 886 detects the presence of a robot blade.

[0110] After data is collected by a PCMD and transferred to a handling system, the data may still need to be transferred to a point where it can be accessed by an end-user. This may be done in a variety of ways, two of which are shown in FIGS. 9A and 9B. For example, the end-user 985 may access the data collected by PCMD 900 by using a laptop computer connected to the handling system by a USB cable, IRDA connection, Wi-Fi or Bluetooth wireless connection, or by use of other technologies. The handling system 980 may connect to a network, such as by an Ethernet connection, to allow the end-user to receive data on a PC at another location. A PDA may be used instead of a PC for receiving and viewing data. Alternatively, the data may be recorded on a flash memory card and physically moved to a laptop, PDA or other device. A software application 987 processes the data sent by the handling system 980 to provide data to end-user 985 in a format that is appropriate. For example, digital data may be converted into temperature readings. Software application 987 may run on a variety of platforms including laptop PC, desktop PC or PDA.

[0111] In one embodiment, the transfer of data from handling system 980 is achieved by using an active RFID transmitter in handling system 980. This takes advantage of the presence of an RFID reader close to the FOUP to transmit data to a network where it may be accessed by an end-user. Semiconductor facilities (Fabs) that use FOUPs generally track the individual FOUPs and their contents by means of RFID tags. Tags are generally passive devices capable of providing an identification number when they are interrogated by a reader. A reader is generally provided at the load port where a FOUP connects to a processing system so that the identity of the FOUP at the load port at any particular time is known. A network of such readers throughout the Fab are connected to a software system that can monitor the position of different FOUPS and coordinate the movement of FOUPs to optimize efficiency. Certain industry standards regarding such a network are detailed in “General model for communications and control of manufacturing equipment,” (GEM), SEMI E30 and SEMI E87-0703. The presence of such a reader connected to a network provides a convenient way to transfer data from a handling system to an end-user.

[0112] An active RFID transmitter may be used to send recorded data and other information from a handling system to a reader. The network may be configured to process data in packets corresponding in size to the identification number for a FOUP, typically 80 bytes. In this case, the information from handling system may need to be sent in a series of 80 byte chunks. Using an RFID system for this purpose has the advantage that the receiving hardware already exists at the desired location and is connected to a network, the transmission is over a very short range and thus requires very little power and does not generally suffer from interference from neighboring systems. Three types of RFID are at this time commonly used, a low frequency system at a frequency of 125 kHz that has a range of less than 12 inches, a medium frequency system operating at 13.56 MHz that has a range of about 90 feet and a high frequency system with a frequency of 2.4 GHz and a range in excess of 100 feet. Any of these may be used for sending data according to this invention. Active RFID transmitters may transmit in 3-dimensions so that the alignment of the transmitter and reader are not critical. One example of such a transmitter is an ECM electronics 3DC1515. While the above example refers to FOUP technology used with 300 mm wafers, this aspect of the invention may also be used with other industry standard substrates and substrate carriers such as 200 mm wafers and SMIF (standard mechanical interface). Similar industry standards exist for other substrates and carrier.

[0113] In the system illustrated in FIG. 9A, the end-user in the fabrication facility manually initiates one or more of data transfer from the handling system 980, loading into and unloading the PCMD 900 from the handling system 980, and the like. Consistent with the trend for fabrication facilities to become more computer controlled with little or no intervention by a facility engineer or other end user, communication with the handling system 980 may be made automatic, such as illustrated in FIG. 9B. Measurement and other data and commands are transmitted between the handling system 980 and a computer 983 by one of Bluetooth, WAN, IRDA or RFID, or others, as described above with respect to FIG. 9A. The computer 983 operates according to application software 981 to control operation of and transfer of data with the handling system 980 and PCMD 900. The computer 983 is preferably connected to a central computer system through an interface 984, according to the SECSII, GEM or other appropriate bus standard.

[0114] A charger 982 of the batteries within the handling system 980 preferably includes a split transformer, also commonly known as an inductive power coupling device, that allows connection of charging power without the need for a solid mechanical or electrical connection of the power source with the handling system. The portion of the split transformer that is connected with the handling system 980 is preferably attached to an outside surface thereof. The mating portion of the split transformer is held fixed in a location where it is abutted by the handling system portion when the handling system 980 is placed in a particular defined location. This allows battery charging to automatically take place when so positioned by the robotic machinery operating the tool or the portion of the fabrication facility in which the PCMD system is being utilized.

[0115]FIG. 2B shows the front or user side of HS 200. A memory card 228 is shown inserted into electronics module 208 and may be considered part of HS 200. HS 200 accommodates any number of memory card formats such as but not limited to the smartcard®, Sony memory stick® the Secure Digital (“SD”) card®, Compact Flash (“CF”), or Multi-Media Card® (“MMC”). A PCMD is sent out “on a survey” to record the various conditions in different types of environments. For each environment and for the entire survey, it may be desirable to alter various parameters of the PCMD such as the sampling rate, sampling duration, and the sensors used. Display 232 quickly conveys information to a user regarding the setup of the PCMD such as the number and arrangement of sensors to be used in a survey, the length and times of the various cycles of a survey, and the sampling rate of the sensors and sensor electronics etc. A survey profile and the data retrieved on the survey may also be stored on the memory card 228 or within flash memory of electronics module 208.

[0116] All the parameters of PCMD 100 and HS 200 may also be accessed and configured by a personal computer or other smart device that communicates via a universal serial bus (USB) of port 224 or via an infrared port 220. They may also be accessed by a remote control communicating to infrared port 220. HS 200 and the PCMDs may also be configured and the data gathered may be manipulated with the function switches 240 that are software driven and control/access the most often used parameters of a PCMD. Indicator lamps 232 also serve to inform the user of the condition of HS 200 and the PCMDs within HS 200. Viewport 244 allows a user to view one or more of the PCMDs.

[0117]FIGS. 3A and 3B are cross sections of embodiments of PCMD 100 (without the components) that will be referenced by the flowcharts of FIGS. 4A and 4B, respectively. The cross sections and flow charts, describing how the PCMDs are made, should be viewed in tandem.

[0118]FIG. 4A describes the process of making an embodiment with a single conductive layer used for the circuit traces. In step 404 of FIG. 4A, insulating layer 304 is formed upon substrate 102. Insulating layer 304 preferably comprises an oxide, but may be any well known insulating material, and may be deposited or grown upon the surface of substrate 102. In step 408, insulating layer 308 is formed upon insulating layer 304. Insulating layer 304 and 308 preferably, but not necessarily, comprise different materials. In the preferred embodiment, insulating layer 308 comprises a nitride. In step 412, a conductive layer 312 is formed upon insulating layer 308. Next, in step 416, electrical traces are patterned and etched in conductive layer 312 according to well known patterning and etching methods. In step 420, passivation layer 316 is formed upon the conductive traces of step 416. In step 424, cavities 142 for components 140 are formed within the substrate through one or more of the layers. The cavities 142 may be mechanically formed or may be etched. In step 428, components 140 (not shown) are inserted within cavities 142 and electrically coupled to the traces in conductive layer 312, seen in FIG. 1C. Next, in step 432, a passivation layer (not shown) is formed over components 140 and the other layers. The passivation layer may comprise any well-known materials, but preferably comprises polyimide or oxynitride. Optionally, step 436 may be performed, in which an electrical and chemical protective shield layer is formed over the passivation layer. This is especially useful in protecting the PCMD from very harsh processing environments such as in plasma etch chambers, as the shield layer is nearly impermeable to the gases and other elements common to such environments. The shield layer should also be resistant to the etching process induced by high energy ion bombardment in plasma chambers. One example of a shield layer is actually a composite of different layers, including a polymer layer such as Mylar® a PE layer, a metallic foil, and a sealant layer such as surlyn®. The total thickness of the shield layer may range from 25 to greater than 99 microns.

[0119]FIG. 4B describes the process of making an embodiment with two conductive layers coupled by inter-level vias. Steps 404 and 408 are the same as those in FIG. 4A. In step 412, the first conductive layer 312A is formed on insulating layer 304. In step 413, a dielectric layer 310 is formed upon conductive layer 312A. After that, openings for vias 312C are formed in dielectric layer 310 in step 414. Next, in step 415, conductive layer 312B and vias 312C are formed on/in the dielectric layer 310. In step 416 electrical traces are patterned and etched in the exposed portion of conductive layers 312A and 312B. Steps 420-436 are the same as in FIG. 4A.

[0120]FIGS. 10A and 10B show examples of lids 1010-1013 protecting components 1020-1022 of the PCMD from the environment. In FIG. 10A, a single lid is used for three components. The number of components covered by a single lid depends on the sizes and locations of the components but may be anything from one component to all the components in the PCMD. FIG. 10A shows three components 1020-1022 and the attached wire bonds 1048 covered by a single lid 1010. In FIG. 10B separate lids 1011-1013 are used for each component 1020-1022. Various materials may be used to form lids such as lids 1010-1013. For example, a ceramic lid similar to that used for packaging integrated circuits may be adapted to cover a component or group of components in a PCMD. For particularly harsh chemical environments lids may be made from materials such as sapphire that resist chemical attack. Where protection from electromagnetic fields is required, lids may be made of conductive material such as metal or doped silicon. For some applications, plastic lids may be used. Lids 1010-1013 are bonded to the substrate 1002 in a conventional manner.

[0121] In the example of FIG. 10C, a single lid 1030 is used to cover the upper surface of the substrate 1002. Lid 1030 may be made of the same material as substrate 1002. For example, where the substrate is made of silicon, the lid may also be made of silicon. Thus, PCMD 1000 resembles a silicon wafer from the outside. Its appearance and characteristics are similar to those of a silicon wafer so that the measured values are as close as possible to the values that would be found in a silicon wafer. The lid 1030 may be bonded to substrate 1002 to form a sealed unit. Cavities within such a unit may be filled with a suitable material to exclude gas that might expand at high temperature and cause the unit to fail.

[0122] In the example shown in FIG. 10D, a three layer structure is used. Traces (not shown) may be formed and components 1020-1022 may be attached to substrate 1002 and bonded to the traces. Then, a second layer 1050 is put in place. This layer has cut-outs formed for the components 1020-1022. This layer may be silicon so that it has similar characteristics to the substrate 1002. Next, a lid 1030 is attached to the upper surface of layer 1050. This method allows cavities to be uniform in depth because the depth of each cavity is equal to the thickness of layer 1050. Also, the upper and lower surfaces of layer 1050 may be highly planar providing good attachment to substrate 1002 and lid 1030.

[0123] In the embodiments of FIGS. 10A-D, the integrated circuit die are preferably attached to the substrate in the manner described above with respect to FIG. 1C, and the thermally conductive potting material may also fill the cavities to protect the delicate lead wires and avoid creation of thermal voids across the substrate 1002.

[0124] An alternative structure of the PCMD to that described above is illustrated in FIGS. 11A and 11B. The sensor, processor and other integrated circuits and electronic components are positioned in enclosed cavities within the substrate. The cavities are preferably formed in a surface of one of top and bottom discs of silicon or other material that are attached together with a thermal and electrical bond to form the finished substrate. The electronic components are connected together by conductors encapsulated within a thin polymer film that is sandwiched between the discs. This film extends its conductors between the components in a manner to cover only a small portion of the area of the discs, therefore minimizing any disturbance of the thermal characteristics of the resulting measuring instrument. The thermal characteristics remain very close to those of a solid disc.

[0125] Referring to FIG. 11A, a circular wafer is shown in plan view. Only fifteen temperature sensors 1301-1315 are shown for simplicity of explanation, many more usually being desired for a typical test wafer. Strips of polymer film containing electrical conductors extend between sensors attached to them and one of two half-circle polymer film segments 1317 and 1319 that contain an interconnecting bus therein. Film strips 1321-1323 extend in straight radial lines and each have two sensors attached, and film strips 1325-1327 are “Y” shaped with three sensors attached to each. Another polymer film segment 1331 positioned between the two bus segments 1317 and 1319 includes the micro-controller and associated electronic components attached to it. The sensors and film strips and segments are contained within the substrate, most conveniently mounted between top and bottom plates having the same outer dimensions. The film segment 1331 extends to another polymer segment 1332 that connects with an external center coil 1333 and four surrounding LEDs 1334 on the top exposed surface. Batteries 1343 and 1345 are electrically connected to the bus in respective half-circle portions 1317 and 1319. There may alternatively be only one battery or more than two batteries installed, depending upon the application and resulting power needs. The sensors, electronic components and power source are thus connected together into a system described elsewhere herein (such as by FIG. 18 hereinafter) by the conductors in the polymer film segments within the substrate structure. The polymer utilized is preferably polyimide.

[0126] The batteries 1343 and 1345 can be mounted on the top surface of the substrate but are preferably also contained within the substrate. A closable opening (not shown) is then provided in one of the plates over each of the batteries for access to replace them during the life of the instrument. It is preferred that both sides of the completed substrate be smooth without any components mounted on these surfaces except that it is necessary in this embodiment for the coil 1333 and LEDs 1334 to be externally mounted.

[0127] Referring to the cross-sectional view taken along the polymer strip 1321, shown in FIG. 11B, cavities 1335 and 1337 are formed in a bottom disc 1339 to contain the respective temperature sensors 1301 and 1302. These temperature sensors are pre-attached to the polymer strip 1321 and directly electrically and mechanically connected to the conductors therein without the use of bond wires. Indeed, the straight polymer strips 1321-1323 are the same, as are each of the “Y” strips 1325-1327, which greatly simplifies manufacturing. Only a limited number of different polymer segment structures need to be made. In this embodiment, only two different sensor assemblies are used plus the electronic component assembly 1331 and the segment 1332 for the coil 1333 and LEDs 1334. In each of these, the components are attached to the polymer segments before installation as a pre-assembled unit into grooves provided in the top surface of the bottom disc 1339 for the polymer to extend between the cavities containing the sensors and other components. The sensors and other components on the individual polymer segments can even be tested and calibrated before installation. Once all the polymer segments are installed in the bottom disc 1339, a top disc 1341 of the same outside shape is then attached to the bottom disc, the combination forming the completed substrate. Alternatively, the grooves for the film strips and segments may be formed on the bottom surface of the top disc 1341. A more complicated layout having many more sensors is implemented in the same manner, although there may be one or a few additional different polymer segment shapes with sensors and/or other components attached.

[0128] The sensors and other components are preferably attached to the bottom of the disc cavities, as illustrated in FIG. 11B where the temperature sensing chips 1301 and 1302 are attached to the bottoms of respective cavities 1335 and 1337. Any space around the sensors and components within their cavities are also preferably filled with thermally conductive material. The adhesive and fill materials can be the same as described above with respect to FIG. 1C. Since the polymer strips and other segments cover only a small portion of the area of the resulting measuring device, the top and bottom discs 1339 and 1341 are firmly mechanically, thermally and electrically attached with an appropriate adhesive over nearly all of the area of the two discs, preferably more than eighty per-cent or even ninety per-cent of their common area. In this example, the bottom and top discs are circular with the same diameter.

[0129] As a result of these features, the sensors, electronic components, conductors, polymer and other elements within the disc perturb the temperatures measured across the wafer very little. Because of the protection provided the electrical elements by the structure of FIGS. 11A and 11B, the device may be used to measure temperatures a variety of hostile environments such as in plasma, wet and plating processes, as well as for tuning a photoresist process hot plate. Of course, the instrument is not limited to these specific applications. Nor is the configuration illustrated in FIGS. 11A and 11B limited to the measurement of temperature, as sensors of other parameters that can be measured from within the structure may be substituted for the temperature sensors. And in most any application, the instrument can be inverted when used, the top and bottom discs being reversed.

[0130] In an alternative embodiment, instead of raising PCMD 800 to move it closer to the electronics module, the electronics module or a portion of the electronics module is lowered to bring it closer to PCMD 800. FIG. 8I shows a portion of an electronics module that contains E-coil 810 being lowered towards PCMD 800. As the distance between E-coil 810 and PCMD 800 decreases, the efficiency of power transfer from E-coil 810 to PCMD 800 improves. Typically, when E-coil is close to PCMD 800, the time to recharge PCMD 800 is about ten minutes.

[0131] When robot blade detector 886 detects a robot blade approaching PCMD 800, moving parts that might interfere with the robot blade must be placed in positions where they do not interfere. Where E-coil 810 is lowered to improve coupling with PCMD 800, it must be retracted before the robot blade attempts to lift PCMD 800. Typically, this means that it must be retracted within 0.1-0.3 seconds from the time that a robot blade is detected by robot blade detector 886.

[0132] In one embodiment, the position of the FOUP door may determine the position of E-coil 810. When the FOUP door is open, the robot may attempt to pick up a PCMD, so E-coil 810 is kept in the raised position. When the FOUP door is closed, the robot will not attempt to pick up the PCMD, so E-coil 810 is placed in the lowered position. The movement of E-coil 810 may be triggered or powered by the movement of the FOUP door. Alternatively, the movement may be powered by a motor or a spring. Linking E-coil motion to the FOUP door motion may make robot blade detector 886 unnecessary.

[0133] A compression algorithm is utilized for the multiple channels of data. The algorithm may use both spatial and temporal compression. It is suitable for signals with small temporal motion and uses an adaptive compression that depends upon signal shape and environment. It comprises three steps: 1) analyzes spatial temperature distribution; 2) analyzes temporal distribution; 3) analyzes temperature profile and characteristics; and 4) compresses or omits certain data based upon differences across the wafer detected in the above steps.

[0134]FIGS. 12-15 illustrate examples of the data compression. Referring initially to FIG. 12, use of the microcontroller 124 (FIG. 1) to process data from the sensors 124 is conceptually illustrated. There are many commercially available microcontrollers that can be employed for this application. One of the MSP430 mixed signal series of microcontrollers available from Texas Instruments Incorporated is one good choice. This microcontroller includes an analog-to-digital converter 1101 and non-volatile flash memory 1103, as well as a central processing unit 1105, volatile random access memory 107 and an input-output interface 1109. The analog outputs of the sensors 124 are sampled one at a time, as indicated by a switching circuit 1111, and converted into a digital signal. The sample rate, namely the setting of the time interval between samples of the sensors outputs, is controlled by a timer 1102 through a control circuit 1113, and may be varied to further reduce the amount of stored data in a manner described below.

[0135] The digital sample values at the output of the ADC 1101 contain a number of bits that can represent the values measured by the sensors with the full resolution that is desired of the system. In an example algorithm, these values are then compressed to values of incremental differences between sensor readings, either temporally (differences between time sequential values detected the same sensors) or spatially (differences between different sensors at the same sample period). The incremental differences are expressed with a far fewer number of bits than the values initially acquired with full resolution. This allows the size of the non-volatile memory on the wafer, or the bandwidth of transmission of the data from the wafer, or both, to be minimized. The amount of battery power used to acquire and store and/or transmit the data is reduced as a result.

[0136] The flowchart of FIG. 13 provides an outline of an example compression algorithm. In a first step 1113, a set of data samples is acquired from sensors 124 at the output of the ADC 1101 (FIG. 12) with the full resolution. This acquisition takes place a “set interval” after values from the same sensors were taken the last time. This interval can be independently controlled, as described below. These data are temporarily stored in the RAM 1107 with the full number of bits, as indicated by a step 1115.

[0137] In a next step 1117, a difference between the value just read from a given one of the sensors 124 and the value read during the immediately preceding cycle for the same sensor is calculated by the CPU 1105. This is done for all the sensors being read and these temporal differences are temporarily stored in the RAM 1107. Similarly, in a next step 1119, differences between the values of the individual sensors being read and one of sensors designated as a reference, all for the present sample period, are calculated and temporarily stored as spatial differences. The stored temporal and spatial differences are then compared in a step 1121 to identify which set of differences are the least. These lesser values are selected for non-volatile storage on the wafer and/or transmission from the wafer to represent the current period output of the sensors with the least amount of data. In one of steps 1123 or 1125, the selected set of difference values is stored. The selected set of differences can be written into the flash memory 1103 in each period or can be accumulated in the RAM 1107 until a block of data exists that makes it more efficient to program together as a block into the flash memory.

[0138] An example table of this difference data obtained during many sample periods is given in FIG. 14 to further illustrate this process. At the beginning of a measurement cycle, in the first data sample period, the values of all the sensor outputs are stored in an uncompressed “full” form in the column marked “start”. This provides an absolute reference from which temporal differences are calculated and the absolute values reconstructed off the wafer during decompression. Similarly, uncompressed data is stored for one of the sensors in each of the sample periods, shown to be sensor 0 in FIG. 14, as an absolute reference from which the spatial differences are calculated and the absolute values later reconstructed.

[0139] In a sample period at time (t−n1), a difference is stored for each sensor between the current sensor reading and that of the immediately preceding sample period, a temporal difference. At another sample period at time (t−n2), a difference is stored for each sensor between its current value and that of the reference sensor 0, a spatial difference. And at the final time period represented in the example of FIG. 14, temporal differences are again calculated and stored to represent the values of the sensor outputs at that time. It may be desirable to limit the frequency of switching between storing temporal or spatial differences by establishing some threshold difference between them to exist before a switch is allowed. Although certain samples are stored as temporal differences and others as spatial differences, their full values can all be reconstructed by a personal computer of other computing device that receives this data, either in real time or after the test is concluded, from the data of the table of FIG. 14.

[0140] Periods when temporal or spatial differences may be preferred can be illustrated by the temperature curve of FIG. 15, which roughly represents the temperature cycle in a photoresist process that rapidly heats the wafer (region 1127), holds a maximum period for a time (region 1129) and then rapidly cools the wafer (region 1131). In the regions 1127 and 1131, the temporal differences are likely greater in magnitude than the spatial temperature differences, assuming the usual goal to maintain the temperature across the wafer substantially uniform. The spatial differences can then be represented by a fewer number of bits of data so will be chosen. In the region 1129, temporal differences may result in the least amount of data to be stored.

[0141] Although automatic selection of the most advantageous of the temporal or spatial differences at each measurement cycle has been described, the process could alternatively be implemented by causing one or the other to be used throughout various portions or all of a given measurement operation, either automatically or by user selection. Useful data compression can also be obtained by a system that calculates only one of the temporal or the spatial differences. One of the steps 1117 and 1119 of FIG. 13 is then omitted, as is also the step 1121 and one of the steps 1123 and 1125.

[0142] Returning to the flowchart of FIG. 13, additional data reduction can optionally take place by controlling the rate of data acquisition, the “set interval” between the taking of successive samples of sensor data. In a first step 1133 of an example process, it is determined whether the set interval should be changed on account of the current absolute value of temperature or other parameter being measured. For example, in FIG. 15, it may be unnecessary to know much about the temperature when below some threshold 1135. In this case, the set interval can be lengthened and thus reduce the amount of data that is acquired and stored. When the temperature is above the threshold 1135, in this example, the shorter set interval is used. This feature will usually be implemented by the user setting such a threshold temperature. Further, more than two set intervals can be provided, each operable within a unique one of more than two temperature ranges. And the two or more temperature ranges may be defined differently, depending upon whether the temperature is rising or falling. Or some criterion other than absolute temperature, either as designated by the user or predetermined, may be used to cause the set interval to change. This all depends upon the application to which the wafer is put.

[0143] So if, in the step 1133, it is determined that a predetermined condition, such as a particular absolute temperature range, exists that calls for a change of the set interval from that used in the just completed acquisition and compression operation, the change is made in a step 1135 and the process returns to the step 1113. It is then repeated with the new set interval for acquiring data samples. An advantage of increasing the set interval whenever possible is that the ADC 1101 and associated components are used less often and thus the wafer battery power consumed by them is reduced.

[0144] But if, in the step 1133, it is determined that no such predetermined condition exists, the processing may proceed to a step 1137 where the set interval may be changed in response to a change in the rate-of-change (slope) of the measured temperature or other parameter. The processing then returns to the step 1113 where a new set of data is acquired and compressed with the changed set interval. Usually, if the slope is great, the set interval is desirably made small, while in the case of a near zero rate-of-change, the set interval can be lengthened without losing any valuable data. The measured temporal differences disclose whether the temperature or other parameter being measured is changing rapidly or not. When on the slopes 1127 and 1131 of the curve of FIG. 15, the set interval can be made short, while when on the flat portion 1129, it can be considerably lengthened.

[0145] It is of course desirable that the test wafer be able to gather and store data for the entire duration (runtime) of the processing operation being monitored. Since it is also desirable to minimize the number and size of the onboard batteries 112 (FIG. 1A), the efficient use of battery power is important. Increasing the set interval between storage of data samples saves power. This and the further data compression also reduce the amount of non-volatile memory of the microcontroller that is necessary to store the data acquired throughout the processing runtime. It is also desired to minimize the amount of such memory that is necessary to include on the test wafer.

[0146] Reference to FIGS. 16A-16D will now be made to describe another wafer handling system embodiment that is a modification of the systems described above with respect to the two wafer handling systems of FIGS. 2A-2B and FIGS. 8A and 8E-8I. Additional and alternative features and structural elements are included. The use of a carrier 1151 for storing and transporting a PCMD 1153, and the techniques for doing so, are substantially the same, however.

[0147] An electronics module 1155 is mounted in the carrier 1151. The PCMD 1153 need not be moved up and down in this embodiment, and is placed within a storage slot a small distance below the electronics module 1155. But rather than being supported by the carrier slot, the weight of the PCMD 1153 rests on several wheels, in this example four wheels 1157-1160, which are carried by structures 1163 and 1165 attached to at least opposite interior walls of the carrier 1151 below the slot designated to receive the PCMD 1153. The outside surfaces of the wheels that are contacted by the PCMD 1153 are preferably padded so as not to cause damage to the PCMD and which frictionally engage the underside of the PCMD in order to rotate it. The wheels 1157-1160 are rotated about their axes by respective individual electrical synchronous motors 1167-1170. The wheels 1157-1160 are confined to rotate about axes that pass through a point that is to be coincident with a center 1173 of the PCMD 1153 placed within the carrier, as indicated by the dashed lines of FIG. 16D. Fewer or more wheels can be used, and/or can be positioned with different radial spacings around the PCMD, so long as the PCMD is supported with stability in a flat position within the carrier.

[0148] Another difference from the earlier described carrier embodiments is the mechanism for charging the batteries on the PCMD 1153 when positioned as shown. Rather than moving the wafer up to the bottom of the electronics module 1155, or the module 1155 down to the wafer, an inductive charging coil 1175 is attached to a bottom surface of a strip 1177 of flexible material, preferably a plastic such as a polyimide about one mil. thick. As best illustrated in FIG. 16B, the strip 1177 is attached at an end 1179 to the underside of the module 1155 at either the front or the back of the carrier 1151. The opposite end of the strip is attached to an arm 1181 of a solenoid 1183 that is attached to the underside of the module 1155 at the other of the front or rear of the carrier 1151. In one position of the solenoid arm 1181, that of FIGS. 16B and 16C, the strip 1177 is lowered so that its coil 1175 rests on a center coil 708 (from the embodiment of FIG. 7) of the PCMD 1153. In the other position of the solenoid arm 1181, the strip 1177 is pulled upward toward the underside of the module 1155, as shown in a dashed line of FIG. 16B and in FIG. 16A. In this position, the PCMD 1153 may be inserted or removed by the facility's robot.

[0149] An advantage of placing the charging coil on the flexible strip 1177 is that little or no magnetic core material needs to be included. This is because the charging coil 1175 is allowed to rest directly on the coil 708 of the PCMD 1153. This provides very good magnetic coupling between the two coils. The strip 1177 and coil 1175 do not harm the PCMD or its coil 708 because of the resulting light weight of the structure.

[0150] The PCMD 1153 includes the four light emitting diodes (LEDs) 728-731 of the PCMD embodiment of FIG. 7. Data is transmitted from the PCMD 1153 to the electronics module 1155 through these LEDs. A single photodetector 1185 is positioned on the underside of the module 1155 to receive the signal emitted by the selected one of the LEDs 728-731 on the PCMD when in the position shown in FIG. 16A. The photodetector 1185 is displaced from the center 1173 of the PCMD when resting in the carrier 1151 as are the LEDs 728-731 on PCMD 1153. More than one photodetector could be used but the use of only one is preferred.

[0151] Also included on the underside of the module 1155 are two line cameras 1187 and 1189 to provide one-dimensional data, along with respective light sources 1191 and 1193. The cameras are positioned to image two portions of an visual rotation position code included around the outside of the PCMD, and the light sources are positioned to illuminate those portions being imaged. Such a code is not shown in FIGS. 16A-16D but it may be the graycode 150 of the PCMD illustrated in FIG. 1D. Data obtained by two cameras radially displaced from each other around the circumference of the PCMD allows the rotational position of the PCMD to be determined and, if less than 180 degrees apart, to determine the center of the PCMD. For peripheral position encoding such as the graycode 150 (FIG. 1D), the cameras 1187 and 1189 may be positioned about 137 degrees apart from each other.

[0152] The module 1155 (FIG. 16A) contains the electronics necessary to communicate with the PCMD 1153, monitor the state of and charge its batteries and perform other functions without having to make a wire connection with the PCMD. These electronics are also battery powered, since the carrier 1151 needs to be portable and is usually moved within a processing facility by a robot. Adequately sized batteries can be included within the relatively large module 1155 but are preferably mounted externally of the carrier 1151 such as on an outside surface thereof. An example of such an electronic system is illustrated by the block diagram of FIG. 17.

[0153] A single integrated circuit microcontroller chip 1201 and one or more flash memory chips 1203 are included on a printed circuit board (not shown) installed in the module 1155. One use of the non-volatile memory 1203 is to store data earlier acquired and stored on the PCMD 1153. This data is transferred from the PCMD by infrared signal transmission, in the example being described, such as described above with respect to FIGS. 7 and 16A-16D. Data from the photodetector 1185 is directed by the controller 1201 to the memory 1203. These data are removed from the module 1155 by any of several methods. One is by loading the data onto a flash memory card 1205 that is removable inserted into a card receptacle provided in the module 1155 (not shown). The controller 1201 directs the data to the memory card 1205 through an interface circuit 1207. Another method of exporting data is through an Universal Serial Bus (USB) interface, which is schematically shown in FIG. 17 by a USB receptacle that physically is placed on the outside of the module 1155 (not shown) and a USB transceiver 1211 on the circuit board within the module 1155. Another way of obtaining the data stored in the flash memory 1203 is through a radio frequency transmitter 1213, which can operate according to a suitable existing standard such as Bluetooth or Wi-Fi.

[0154] Once exported to a personal computer or other suitable computing device, the data may be post-processed including decompressing the data. If compressed according to the techniques described above with respect to FIGS. 12-15, the temporal and/or spatial data, as exists, are combined with those data points stored with full resolution and each other to provide all data values with the full resolution and without any loss.

[0155] In the specific system example of FIG. 17, the primary source of power is a rechargeable battery 1219 that supplies operating power through a power control circuit 1217 to the other components shown. A non-rechargeable back-up battery 1215 may also be included for use in case the battery 1219 become discharged during use. In response to the voltage from the primary battery 1219 dropping below a set threshold, the control circuits 1217 switch away from the battery 1219 and to the battery 1215. A convenient way to recharge the battery 1219 is through a USB connection with a personal computer or other host device, or through a non-contact power path such as the split transformer (not shown) mentioned above. While connected, such a device provides power through the USB receptacle 1209 to a charger 1221 that is operably connected with the battery 1219.

[0156] The controller 1201 also drives the PCMD rotation motors 1167-1170 through a motor control circuit 1223. The battery charging coil positioning solenoid 1183 is also controlled by the controller 1201 through a driving circuit 1225. Data and battery charging energy are provided to the coil 1175 by a radio frequency driver 1227, in response to data and control signals from the controller 1201. Images from the cameras 1187 and 1189 are received and processed by the controller 1201, as are the associated illumination sources 1191 and 1193, which are preferably turned on only when images are being acquired from the cameras 1187 and 1189. A standard RFID radio frequency interface 1229 can also be used for transmitting data and/or receiving commands, as described previously.

[0157] The system of FIG. 17 also conveniently provides user interface devices. A display 1231 can be any of a convenient display device, such as a small LCD screen to provide status information of the control system. For the user to input commands or make inquiries, a standard keyboard can be used but a remote control 1233 will usually be more convenient since it can be made portable. In this case, a remote control interface 1213 with the controller 1201 is provided as part of the system. Both of the control devices 1213 and 1233 are preferably PDAs because of their ready availability, built-in wireless communication capability and relative ease with which they may be adapted to this application.

[0158] A block diagram of the circuits carried by a typical PCMD being described is given in FIG. 18. The microcontroller integrated circuit chip 104, previously described with respect to FIG. 12, is the heart of the data acquisition, storage and exporting functions of a PCMD. Although the parameter sensors may be distributed over the surface of the PCMD according to any number of arrangements or patterns, they are electrically connected in a matrix of n rows and m columns. The row and column connections shown in FIG. 18 are implemented by the conductive traces formed on the surface of the PCMD. Three such rows and three columns are shown in FIG. 18 for simplicity of explanation but many more than nine sensors 1241-1249 will usually be employed. More than fifty is typical, such as sixty-four sensors in a matrix of eight-by-eight sensors, or more. In the example being described, the sensors are individual integrated circuits of the type described earlier where, in response to being provided power, output a voltage or current related to the value of the parameter being measured, such as temperature.

[0159] In the example of FIG. 18, data are acquired from one column of sensors at a time. The controller turns on power to one of the m column lines at a time, in sequence, while leaving the sensors in the remaining columns without power. Each sensor in the energized column then outputs its parameter dependent voltage onto a different one of the n row lines to which it is connected. The individual sensor voltages on the row lines are then converted into digital signals, one at a time, by an analog-to-digital converter circuit within the controller 104, as previously describe with respect to FIG. 12. After the data from one column of sensors are converted and stored in a memory within the controller 104, power to that column is turned off by the controller 104 and power turned on to the next in order column line. Parameter values are obtained from the sensors in that column and stored in the same manner. This continues until data has been acquired from all the sensors in the matrix. A short time later, the process repeats to update the values of the parameters being sensed by the sensors across the PCMD.

[0160] Data so acquired and stored within the controller 104 are transferred to the electronics module 1155 of the wafer carrier (FIGS. 16A and 17) by one of the LEDs 728-731 that is most closely positioned to the photodetector 1185, as described above with respect to FIG. 7. In order to save power and reduce the peak current that is necessary for the controller to provide to the LEDs, each is preferably driven by the voltage stored in a capacitor connected to it that has been charged through a resistor. Such a charging circuit is shown in FIG. 18 to be connected to each of the LEDs 728-731. When the controller then connects to one of the LEDs through an internal switching transistor to generate an infra-red pulse from the LED, the necessary current to do so is supplied by its capacitor discharging through the LED.

[0161] The controller 104 utilizes an external clock source 1253, a preferred clock described above with respect to FIG. 6. Power is supplied to the controller 104 through a voltage regulator 1255 from battery(ies) 1257 attached to the PCMD. The voltage output of the battery power source 1257 is monitored by the controller 104 through a level shifting circuit 1259. The controller uses its analog-to-digital converter to first convert this analog signal to a digital value.

[0162] When the PCMD is positioned in a carrier such as shown in FIG. 16A, the electronic system therein (FIG. 17) electromagnetically talks with the PCMD electronic system (FIG. 18) through their adjacent coils 1175 and 708 (FIG. 16C). Commands, status inquiries or other communications received by the coil 708 of the PCMD are received by the controller 104 (FIG. 18) through a line 1261 connected to one side of the coil. When the battery 1257 is to be charged, a voltage level placed on a line 1263 by the controller 104 enables a rectifier 1265 to receive the output of the coil 708. A d.c. output of the rectifier 1265 is then connected across the battery 1257.

[0163] Since the minimization of the amount of power consumed by the PCMD is quite important, as discussed in various places above, the controller 104 operates to turn off its power by generating a sleep signal in a line 1267 that is connected with the voltage regulator 1255.

[0164] The embodiments described above have applications in monitoring processing conditions in locations other than processing chambers. Conditions experienced by wafers during transport and storage may also affect the characteristics of the devices produced and therefore it may be desirable to measure and record such conditions. For example, a PCMD may remain in a FOUP to record conditions in the FOUP. This data may be recorded in the PCMD or may be transmitted by RFID without being stored.

[0165] While particular embodiments of the present invention and their advantages have been shown and described, it should be understood that various changes, substitutions, and alterations can be made therein without departing from the spirit and scope of the invention as defined by the appended claims. For example, the location and type of the sensors may be different than in the examples described. 

1. A sensing apparatus for sensing conditions in target environments in a processing facility where a standard substrate is transported in a standard substrate carrier that establishes a position of the standard substrate relative to a surface of the standard substrate carrier and where the robot of at least one processing tool is calibrated to the position of the standard substrate relative to the surface of the standard substrate carrier, comprising: a first portion that includes: a substrate; a plurality of sensors attached to the substrate; a second portion that includes: a substrate carrier that establishes the position of the first portion relative to a surface of the substrate carrier to be the same as the position of the standard substrate relative to the surface of the standard substrate carrier; an electronics module that communicates with the first portion, the electronics module attached to the substrate carrier; and wherein the first portion may be moved independently of the second portion.
 2. The sensing apparatus of claim 1 wherein the substrate carrier is a standard substrate carrier.
 3. The sensing apparatus of claim 1 wherein the position of the standard substrate relative to the surface of the standard substrate is the vertical height of the standard substrate above the bottom surface of the standard substrate carrier.
 4. The sensing apparatus of claim 1 further comprising: a receiving unit attached to the substrate that receives power from the electronics module; and a transmitting unit in the electronic module that transmits power to the receiving unit.
 5. The sensing apparatus of claim 4 wherein the receiving unit is located at the center of the substrate so that when the substrate is placed in the substrate carrier the receiving unit is aligned with the transmitting unit regardless of the rotational orientation of the substrate.
 6. The sensing apparatus of claim 4 wherein the receiving unit receives data from the electronics module and the transmitting unit transmits data to the receiving unit.
 7. The sensing apparatus of claim 4 wherein the transmitting unit comprises an E-coil and the receiving unit comprises a conductive coil and a magnetic conductive layer.
 8. The sensing apparatus of claim 1 wherein the second portion further comprises an RFID transceiver electrically connected to the electronics module so that data may be sent from the electronics module to the RFID transceiver and data may be sent from the RFID transceiver to an external receiver.
 9. The sensing apparatus of claim 1 further comprising: a pattern on at least one surface of the substrate; and an optical reading apparatus attached to the substrate carrier that reads the greycode pattern on the substrate to determine the orientation of the substrate.
 10. The sensing apparatus of claim 1 wherein the second portion further comprises an alignment module that aligns the first portion relative to the substrate carrier.
 11. A sensing apparatus for sensing process conditions in a processing tool that has a robot that transfers a standard substrate between a standard substrate carrier and a process chamber, comprising: a process condition measuring device, comprising: a substrate; a plurality of sensors attached to the substrate; a handling system, comprising: a substrate carrier that holds the process condition measuring device, the robot transferring the process condition measuring device between the substrate carrier and the process chamber; and an electronics module attached to the substrate carrier that communicates with the process condition measuring device while the substrate carrier holds the process condition measuring device.
 12. The sensing apparatus of claim 11 wherein the substrate carrier is a standard substrate carrier.
 13. The sensing apparatus of claim 1 wherein the substrate carrier is a front opening unified pod (FOUP).
 14. The sensing apparatus of claim 11 wherein the substrate carrier is a wafer cassette.
 15. The sensing apparatus of claim 11 wherein the process condition measuring device further includes at least one battery and other components attached to the substrate and the location of the at least one battery and the other components that are attached to the substrate are configured such that the center of gravity of the substrate with the at least one battery and the other components is the same as the center of gravity of the substrate alone.
 16. The sensing apparatus of claim 11 wherein the process condition measuring device further includes conductive traces connecting sensors to a CPU, at least one battery, a clock crystal and an RF inductive coil.
 17. A process condition measuring device for measuring conditions in a target environment, comprising: a substrate; a plurality of sensors attached to the substrate; and a plurality of components located on the surface of the substrate or within cavities formed in the surface of the substrate such that the balance of the substrate with the plurality of sensors and the plurality of components is the same as the balance of the substrate alone when the substrate spins about a central axis.
 18. The process condition measuring device of claim 17 wherein the center of gravity of the process condition measuring device is along a central axis of the process condition measuring device, the central axis passing perpendicularly through the center of the surface of the substrate.
 19. The process condition measuring device of claim 17 wherein the target environment is a process chamber that processes substrates having predetermined physical dimensions and the physical dimensions of the process condition measuring device are the same as the predetermined physical dimensions.
 20. The process condition measuring device of claim 17 wherein the plurality of components includes two or more batteries that are located equidistant from the central axis and at opposite sides of the central axis.
 21. The process condition measuring device of claim 17 further comprising an energy receiving device comprising an RF induction coil overlying an RF return pad located at the center of the substrate.
 22. The process condition measuring device of claim 17 further comprising a plurality of data transmitting devices that transmit data from the process condition measuring device.
 23. The process condition measuring device of claim 22 wherein the data transmitting devices are LEDS at different locations and wherein individual ones of the plurality of LEDs may be separately enabled or disabled.
 24. The process condition measuring device of claim 17 further comprising a CPU that is mounted to the substrate and is individually covered by a prefabricated lid.
 25. The process condition measuring device of claim 24 further comprising a memory IC and a clock crystal and wherein the CPU, the memory IC and the clock crystal are individually covered by prefabricated lids.
 26. The process condition measuring device of claim 17 further comprising a single prefabricated lid that covers most or all of a surface of the substrate and covers a plurality of components mounted on the surface or mounted within individual cavities within the surface.
 27. The process condition measuring device of claim 26 wherein the lid is composed of the same material as the substrate.
 28. The process condition measuring device of claim 17 further comprising a crystal oscillator circuit, the circuit having a temperature compensation feature that modifies a bias voltage within the crystal oscillator circuit to compensate for temperature changes.
 29. A method of surveying conditions in a target environment comprising: robotically moving a process condition measuring device from a substrate carrier to a target environment; acquiring data in the target environment and recording the data in the process condition measuring device; robotically returning the process condition measuring device to the substrate carrier; and transferring the data from the process condition measuring device to an electronics module attached to the substrate carrier while the process condition measuring device is in the substrate carrier.
 30. The method of claim 29 further comprising transferring energy from the electronics module to the process condition measuring device and storing the energy within the process condition measuring device.
 31. The method of claim 29 further comprising sending the data from the electronics module attached to the substrate carrier to a receiver that is not attached to the substrate carrier.
 32. The method of claim 29 wherein the substrate carrier is a cassette.
 33. The method of claim 29 wherein the substrate carrier is a front opening unified pod (FOUP).
 34. The method of claim 29 wherein transferring the data from the process condition measuring device to an electronics module is by light from an LED, the LED being selected from a plurality of LEDs in the process condition measuring device according to a routine that selects the optimum LED.
 35. The method of claim 29 wherein the process condition measuring device comprises a plurality of electrical components having specified operating temperature ranges and the process conditioning measuring device experiences a high temperature in the target environment that is outside the specified operating temperature range of at least one of the plurality of electrical components, the process condition measuring device having temperature compensation circuitry to allow the process condition measuring device to operate at the high temperature.
 36. The method of claim 29 wherein the process condition measuring device is spun at high speed in the target environment.
 37. The method of claim 29 further comprising determining the position of the process condition measuring device in the substrate carrier.
 38. The method of claim 29 further comprising moving the process condition measuring device in the substrate carrier.
 39. The method of claim 29 further comprising changing the rotational orientation of the process condition measuring device in the substrate carrier.
 40. The method of claim 29 further comprising moving a portion of the electronics module while the process condition measuring device is in the substrate carrier.
 41. A method of making a process condition measuring device that may collect data and may record or transmit the data for subsequent use, comprising: depositing a conductive layer on a substrate; patterning the conductive layer to form a plurality of traces; forming a plurality of cavities in the substrate; placing a plurality of electrical components in the plurality of cavities, the plurality of components including at least one sensor and at least one battery; connecting individual ones of the plurality of electrical components to one or more of the plurality of traces; and depositing a passivation layer over the traces and components.
 42. The method of claim 41 further comprising forming a shield layer over the passivation layer.
 43. The method of claim 42 wherein the shield layer is comprised of a composite of different layers.
 44. The method of claim 41 further comprising forming a second conductive layer and patterning the second conductive layer to form a second plurality of traces.
 45. An instrument for measuring a parameter, comprising: a substrate, a plurality of sensors carried by and distributed at positions across a surface of the substrate that individually measure the parameter at those positions, at least one electronic processing component carried by the substrate surface, electrical conductors extending across the substrate surface and connected to the plurality of sensors and said at least one electronic processing component, wherein the sensors and said at least one electronic component are positioned in cavities formed into the substrate surface, and a material filling the cavities around the sensors and said at least one electronic component.
 46. The instrument of claim 45, additionally comprising a rigid protective cover extending across the substrate over at least the sensors and said at least one electronic component.
 47. The instrument of claim 45, wherein the substrate is a circularly shaped silicon wafer.
 48. The instrument of claim 47, wherein the parameter being measured includes temperature.
 49. The instrument of claim 45, wherein measurement of the parameter by the sensors depends at least in part upon their temperature, the substrate has given thermal characteristics and the material filling the cavities have the given thermal characteristics of the substrate.
 50. The instrument of claim 49, wherein the parameter being measured includes temperature.
 51. The instrument of claim 45, wherein at least some of the sensors and said at least one electronic processing component are integrated circuit die attached to bottoms of the cavities.
 52. The instrument of claim 45, wherein the material filling the cavities includes a cured polymer and at least seventy per-cent by volume of particles of thermally conductive material.
 53. The instrument of claim 52, wherein the material filling the cavities is electrically insulative.
 54. The instrument of claim 53, wherein the sensors and said at least one electronic processing component are attached to bottoms of the cavities by an adhesive material that contains particles of thermally conductive material and that is electrically insulative.
 55. The instrument of claim 54, wherein at least some of the sensors and said at least one electronic processing component are integrated circuit die attached to bottoms of the cavities.
 56. The instrument of claim 55, wherein the electrical conductors are connected to the integrated circuit die by wire leads attached between the electrical conductors and bonding pads of the circuit die.
 57. The instrument of claim 56, wherein the material filling the cavities also extends around the wire leads for protection of them.
 58. The instrument of claim 45, wherein the electrical conductors are encapsulated in an insulating film to which the plurality of sensors and at least one electronic processing component are physically attached in a manner to make electrical connections with the electrical conductors therein.
 59. The instrument of claim 58, additionally comprising a rigid protective cover extending across the substrate over at least the sensors, said at least one electronic processing component and the electrical conductors encapsulated in an insulating film.
 60. The instrument of claim 59, wherein the electrical conductors and the insulating film encapsulating them extend between the plurality of sensors and said at least one electronic processing component in grooves formed in one of the substrate and cover, and the substrate and cover are rigidly attached to each other in abutting surface regions between the grooves.
 61. The instrument of claim 60, wherein the attached abutting surface regions of the substrate and cover extend over at least eighty percent of a common area of the substrate and cover.
 62. The instrument of claim 61, wherein the substrate and cover are each circular in shape with the same diameter.
 63. A measuring instrument, comprising: first and second substrate portions held together at a common interface, a plurality of cavities positioned between the first and second substrate portions, a plurality of grooves positioned between the first and second substrate portions and extending between the plurality of cavities, strips of electrically insulative film with electrical conductors therein positioned within the grooves, a plurality of sensors of a parameter and electronic components positioned within the cavities and electrically connected with the electrical conductors in the film strips, and wherein the first and second substrate portions are directly attached together in regions of their common interface between the grooves and cavities.
 64. The instrument of claim 63, wherein the first and second substrate portions are each circular discs having the same diameter.
 65. The instrument of claim 63, wherein the plurality of cavities and the plurality of grooves are arranged so that one or more patterns of segments of the film strips are repeated across the interface between the first and second substrate portions, thereby to simplify manufacture of the instrument.
 66. The instrument of claim 65, wherein the sensors and electronic components have been attached to the film strip segments before installation in the cavities and grooves.
 67. The instrument of claim 63, wherein the regions of the first and second substrate portions that are directly attached together exceed eighty per-cent of their common interface.
 68. An instrument for measuring a parameter, comprising: a silicon wafer substrate having opposing planar surfaces, a plurality of recesses formed in said one substrate surface at positions distributed thereacross and having bottom surfaces, a plurality of sensors in the form of silicon integrated circuit die attached to the bottom surfaces of at least some of the recesses, thereby providing measurements of the parameter at positions distributed across said one substrate surface, at least one silicon electronic processing integrated circuit die attached to the bottom surface of at least one of the recesses, electrical conductors extending across said one substrate surface between at least the recesses containing the integrated circuit die, lead wires extending between and bonded to pads of the integrated circuit die and electrical conductors adjacent the recesses in which the die are attached, and a protective material filling the recesses around the integrated circuit die and extending around the lead wires.
 69. The instrument of claim 68, wherein the integrated circuit die are attached to the bottoms of the recesses by an adhesive that includes heat conductive particles.
 70. The instrument of claim 69, wherein the protective material includes heat conductive particles.
 71. The instrument of claim 70, wherein the adhesive and protective material are electrical insulators.
 72. The instrument of claim 68, additionally comprising at least one additional electronic component attached to the bottom surface of at least one of the recesses and connected with the electrical conductors adjacent the at least one component.
 73. A parameter measuring system, comprising: a portable measuring instrument comprising a substrate with a plurality of sensors of the parameter spatially distributed thereacross, a first electronics system including a processor connected with the sensors and data storage, a power storage system connected to operate the sensors and electronics system, and a coil connected to at least receive electromagnetic energy for recharging the power storage system, a docking station comprising a surface that supports the measuring instrument when inserted therein from a side, a module positioned above the supporting surface that contains a second electronics system including a processor, a flexible film carried by an underside of the module, a coil physically attached to the film and electrically driven by the second electronics system to provide electromagnetic energy to recharge the power storage system of the measuring instrument, and a mechanism carried by the underside of the module that lowers the film to rest its coil on the coil of the measuring instrument when carried by the surface in order to recharge the power storage system under control of the first and second electronics systems.
 74. The system of claim 73, wherein the film is attached at one extreme to the underside of the module and the lowering mechanism includes an electromagnetic device attached to an opposite extreme of the film for providing slack in the film to rest on the measuring instrument and relative tautness in the film to raise it above the measuring instrument.
 75. The system of claim 73, wherein the surface of the docking station that supports the measuring instrument includes a plurality of wheels upon which the measuring instrument rests, the wheels being constrained to rotate about axes which intersect in a center of the measuring instrument and being powered by individual electrical motors, thereby to rotate the measuring instrument about said center when the electrical motors are energized.
 76. In a battery powered portable measuring instrument including a substrate with a plurality of sensors of a parameter distributed across a surface thereof, a method of compressing the amount of data obtained from the sensors of the parameter by processing on the measuring instrument, comprising: calculating a first set of differences between values of the parameter read at different times by individual sensors, calculating a second set of differences between values of the parameter read at a given time by the plurality of sensors, and selecting one of the first set or second set of differences that represents the values of the parameter read by the sensors with the lesser amount of data. 